ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,240, issued on July 14, was assigned to Telefonaktiebolaget LM Ericsson (Publ) (Stockholm). "Adaptor for an optical connector" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,241, issued on July 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Optical cable assembly with mismatched fiber lengt... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,242, issued on July 14, was assigned to Panduit Corp. (Tinley Park, Ill.). "High density fiber cassette and enclosure" was invented by Thom... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,243, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Thermal structure for a micro-ring resonator (MRR) in a photoni... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,244, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Photonic alignment device and method" was invented by Yonggang ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,245, issued on July 14, was assigned to Ayar Labs Inc. (San Jose, Calif.). "Direct silicon-to-silicon bonding for fiber-first packaging pro... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,246, issued on July 14, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic package having connector f... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,247, issued on July 14, was assigned to Infinera Corp. (San Jose, Calif.). "Thermal management of pluggable optical transceiver" was invent... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,248, issued on July 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Electrical connection socket, photoelectric modul... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,249, issued on July 14, was assigned to Apple Inc. (Cupertino, Calif.). "3D system and wafer reconstitution with mid-layer interposer" was ... Read More